Such a high reliability of the materials.

As the electronic equipment function is more and more strong, the body is more and more small, heat dissipation problems have become more and more complicated. Engineers have been looking for a better thermal interface materials, effective heat dissipation to help electronic equipment. Amorphous polymer material is a poor conductor of heat, because their disorder limits the heat conduction transfer of phonons. In the polymer can be used to create neat crystal structure to improve its thermal conductivity, but the structure is formed by fiber drawing process, can lead to brittle materials.
George woodruff school of mechanical engineering at Georgia tech, said barak figure DE carat, assistant professor of new thermal interface material is made by using conjugated polymer poly (thiophene and its neat nanofiber arrays are not only good for transfer of phonon, and avoid the brittleness of materials. New materials in the thermal conductivity at room temperature is 4.4 w/m, kelvin, and has set up 80 times in 200 ℃ temperature thermal cycle test, performance remained stable; Between the chip and heat sink, by contrast, commonly used solder thermal interface materials, work in the process of the high temperature of reflow may become unreliable.
Nanometer fiber array structure is made by multiple steps: researchers first electrolyte containing a single coated on a tiny pore alumina template, and then to the template applied potential, every pore of electrode will attract monomer, began to form hollow nanofibers. Fibre length and wall thickness by applying the electrical flow and time control, the diameter of the fiber is determined by the size of the pore, ranging from 18 nm to 300 nm. The thickness of the traditional thermal interface materials about 50 microns to 75 microns, and this way to get new material thickness can be thin to 3 microns.
Carat, said the technology still needs further improvement, but he believes that the future can expand production and commercialization. “Such a high reliability of the materials for solving the problem of heat dissipation is very attractive. The material may eventually change the way we design electronic system.”